帮忙翻译一下，急

根据贵司反馈的不良信息，贵司此次抱怨的开关端子下陷不良，为我司针对柄装弹簧防呆改善后送样贵司的样品

因此次样品是采用普通料注塑开关本体，开关耐温性能达不到400℃/3S的焊锡标准，造成开关经过400℃/3S焊锡后出现端子下陷现象

建议贵司制程焊锡作业时，将开关平摆放焊锡作业，不要坚摆放焊锡作业；因开关坚摆放焊锡作业，端子下面没支撑点，容易造成开关端子倾斜摇摆

建议贵司将焊锡作业时间与温度管制在开关焊锡标准之内

According to your feedback information, and the poor complain switch, as we sink terminals in spring prevention hilt fittings for improving your sample after expressly

Therefore times using common material molding sample is heat-resistant property, switch switch ontology reach 400 ° c/s, switch of solder standard after 400 ° c/s solder sink phenomenon occurred after terminals

Suggest your homework, soldering process will switch flat, don't put solder Kennedy, put solder For homework, put solder switch established under the terminal point, not easy to switch tilts terminals

Suggest you time and temperature control solder assignments in the switch solder standard

我纯粹凑热闹的哈..

Negative feedback information according to your, your company to complain about the poor settlement switch terminals, for my heart touching the Division for the spring loaded handle like your samples to improve the evacuation Therefore, sub-sample is the ordinary material injection switch body, the switch temperature performance up to less than 400 ℃ / 3S solder standards, resulting in switching after 400 ℃ / 3S solder terminals after subsidence phenomenon Recommended solder process your company operations, it will switch level soldering work place, do not firmly placed solder operations; by switching firmly placed solder operations, terminal did not support points below, likely to cause switch terminal tilt swing Recommend your company time and temperature of the soldering operation to control switch within the solder standards