i5-520E i5-520m
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解决时间 2021-01-04 13:41
- 提问者网友：你挡着我发光了
- 2021-01-03 19:43
i5-520E i5-520m的区别
最佳答案
- 五星知识达人网友：雪起风沙痕
- 2021-01-10 05:34
详细信息都在下面了，自己慢慢看其中区别！
Model number ? I5-520M
CPU part number CN80617004119AE (SLBNA)
Frequency (MHz) ? 2400
Turbo frequency (MHz) 2933 (1 core)
2667 (2 cores)
Low power frequency (MHz) 1200
Clock multiplier ? 18
Package 1288-ball micro-FCBGA10
Size 1.34" x 1.1" / 3.4cm x 2.8cm
Introduction date January 7, 2010
Price at introduction $225
Architecture / Microarchitecture
Microarchitecture Nehalem (Westmere)
Platform Calpella
Processor core ? Arrandale
Core stepping ? C2 (SLBNA)
Manufacturing process 0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
Die size 81 (CPU die)
114 (IMC / graphics die) mm2
Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size ? 2 x 256 KB
Level 3 cache size 3 MB
Multiprocessing Not supported
Features MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
AES instructions
EM64T technology ?
Hyper-Threading technology ?
Turbo Boost technology ?
Execute Disable bit ?
Virtualization technology (VT-x and VT-d)
Trusted Execution Technology
Low power features Thread C1, C3 and C6 states
Core C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced SpeedStep technology ?
On-chip peripherals Integrated dual-channel DDR3 SDRAM Memory controller
Direct Media Interface
Integrated HD graphics controller
Electrical/Thermal parameters
V core (V) ? 0.8 - 1.4 (High Frequency mode)
0.775 - 1 (Low Frequency mode)
Minimum/Maximum operating temperature (°C) ? 0 - 105
Maximum power dissipation (W) ? 3.8 (TDP in C6 state) / 67.2 (peak, CPU core only)
44.8 (sustained, CPU core only)
Thermal Design Power (W) ? 35 (Package)
25 (CPU core)
12.5 (Graphics core)
Model number ? I5-520E
CPU part number CN80617004461AB (SLBP6)
Frequency (MHz) ? 2400
Clock multiplier ? 18
Package 1288-ball micro-FCBGA10
Size 1.34" x 1.1" / 3.4cm x 2.8cm
Introduction date January 7, 2010
Price at introduction $225
Architecture / Microarchitecture
Microarchitecture Nehalem (Westmere)
Platform Calpella
Processor core ? Arrandale
Core stepping ? C2 (SLBP6)
Manufacturing process 0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
Die size 81 (CPU die)
114 (IMC / graphics die) mm2
Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size ? 2 x 256 KB
Level 3 cache size 3 MB
Multiprocessing Not supported
Features MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
AES instructions
EM64T technology ?
Hyper-Threading technology ?
Turbo Boost technology ?
Execute Disable bit ?
Virtualization technology (VT-x and VT-d)
Trusted Execution Technology
Low power features Thread C1, C3 and C6 states
Core C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced SpeedStep technology ?
On-chip peripherals Integrated dual-channel DDR3 SDRAM Memory controller
Direct Media Interface
Integrated HD graphics controller
Electrical/Thermal parameters
V core (V) ? 0.8 - 1.4 (High Frequency mode)
0.775 - 1 (Low Frequency mode)
Minimum/Maximum operating temperature (°C) ? 0 - 105
Maximum power dissipation (W) ? 3.8 (TDP in C6 state) / 67.2 (peak, CPU core only)
44.8 (sustained, CPU core only)
Thermal Design Power (W) ? 35 (Package)
25 (CPU core)
12.5 (Graphics core)
Model number ? I5-520M
CPU part number CN80617004119AE (SLBNA)
Frequency (MHz) ? 2400
Turbo frequency (MHz) 2933 (1 core)
2667 (2 cores)
Low power frequency (MHz) 1200
Clock multiplier ? 18
Package 1288-ball micro-FCBGA10
Size 1.34" x 1.1" / 3.4cm x 2.8cm
Introduction date January 7, 2010
Price at introduction $225
Architecture / Microarchitecture
Microarchitecture Nehalem (Westmere)
Platform Calpella
Processor core ? Arrandale
Core stepping ? C2 (SLBNA)
Manufacturing process 0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
Die size 81 (CPU die)
114 (IMC / graphics die) mm2
Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size ? 2 x 256 KB
Level 3 cache size 3 MB
Multiprocessing Not supported
Features MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
AES instructions
EM64T technology ?
Hyper-Threading technology ?
Turbo Boost technology ?
Execute Disable bit ?
Virtualization technology (VT-x and VT-d)
Trusted Execution Technology
Low power features Thread C1, C3 and C6 states
Core C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced SpeedStep technology ?
On-chip peripherals Integrated dual-channel DDR3 SDRAM Memory controller
Direct Media Interface
Integrated HD graphics controller
Electrical/Thermal parameters
V core (V) ? 0.8 - 1.4 (High Frequency mode)
0.775 - 1 (Low Frequency mode)
Minimum/Maximum operating temperature (°C) ? 0 - 105
Maximum power dissipation (W) ? 3.8 (TDP in C6 state) / 67.2 (peak, CPU core only)
44.8 (sustained, CPU core only)
Thermal Design Power (W) ? 35 (Package)
25 (CPU core)
12.5 (Graphics core)
Model number ? I5-520E
CPU part number CN80617004461AB (SLBP6)
Frequency (MHz) ? 2400
Clock multiplier ? 18
Package 1288-ball micro-FCBGA10
Size 1.34" x 1.1" / 3.4cm x 2.8cm
Introduction date January 7, 2010
Price at introduction $225
Architecture / Microarchitecture
Microarchitecture Nehalem (Westmere)
Platform Calpella
Processor core ? Arrandale
Core stepping ? C2 (SLBP6)
Manufacturing process 0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
Die size 81 (CPU die)
114 (IMC / graphics die) mm2
Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size ? 2 x 256 KB
Level 3 cache size 3 MB
Multiprocessing Not supported
Features MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
AES instructions
EM64T technology ?
Hyper-Threading technology ?
Turbo Boost technology ?
Execute Disable bit ?
Virtualization technology (VT-x and VT-d)
Trusted Execution Technology
Low power features Thread C1, C3 and C6 states
Core C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced SpeedStep technology ?
On-chip peripherals Integrated dual-channel DDR3 SDRAM Memory controller
Direct Media Interface
Integrated HD graphics controller
Electrical/Thermal parameters
V core (V) ? 0.8 - 1.4 (High Frequency mode)
0.775 - 1 (Low Frequency mode)
Minimum/Maximum operating temperature (°C) ? 0 - 105
Maximum power dissipation (W) ? 3.8 (TDP in C6 state) / 67.2 (peak, CPU core only)
44.8 (sustained, CPU core only)
Thermal Design Power (W) ? 35 (Package)
25 (CPU core)
12.5 (Graphics core)
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